1. A variety of models to meet the needs of different scenarios of mobile phone repair
2. High rigidity and flexibility
3. Hand-sharpened blades
4. 5 models:
Ma1.0: pry to remove the glue from IC and CPU
Ma2.0: corner knife scraping IC peripheral glue
Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
Ma4.0: prying IC hard disk
Ma5.0: prying CPU IC hard disk and CPU layering
2. High rigidity and flexibility
3. Hand-sharpened blades
4. 5 models:
Ma1.0: pry to remove the glue from IC and CPU
Ma2.0: corner knife scraping IC peripheral glue
Ma3.0: special-shaped rubber tapping knife, cut vinyl without hurting the board
Ma4.0: prying IC hard disk
Ma5.0: prying CPU IC hard disk and CPU layering