1. Uses a high-quality silicone adhesive formula; leaves no sticky residue after cooling and removal.
2. Made of high-strength polyimide film material, possessing stable insulation properties, good tensile strength, tear resistance, and chemical corrosion resistance.
3. Can withstand short-term high temperatures up to 400 degrees Celsius, effectively protecting sensitive chips, cables, and components near the motherboard from damage caused by hot air guns and soldering irons during motherboard repair.
4. Specifically designed for mobile phone motherboard maintenance, chip desoldering, screen repair, BGA rework, and other high-temperature soldering projects.
5. The thin and flexible film can closely adhere to curved and irregular surfaces.
2. Made of high-strength polyimide film material, possessing stable insulation properties, good tensile strength, tear resistance, and chemical corrosion resistance.
3. Can withstand short-term high temperatures up to 400 degrees Celsius, effectively protecting sensitive chips, cables, and components near the motherboard from damage caused by hot air guns and soldering irons during motherboard repair.
4. Specifically designed for mobile phone motherboard maintenance, chip desoldering, screen repair, BGA rework, and other high-temperature soldering projects.
5. The thin and flexible film can closely adhere to curved and irregular surfaces.