1. Blade diameter: 2.0mm
2. High-hardness blade material, wear-resistant, long service life
3. For scraping off adhesive from mobile phone motherboards, IC chips, BGA underfill, and PCB boards
4. Specially designed safety tip prevents scratching or cutting integrated circuit chips, PCB circuit boards, and copper pads
5. Quickly removes cured adhesive, black adhesive on chips, and residual filler
6. Ergonomic non-slip handle provides a stable grip for delicate operations.
2. High-hardness blade material, wear-resistant, long service life
3. For scraping off adhesive from mobile phone motherboards, IC chips, BGA underfill, and PCB boards
4. Specially designed safety tip prevents scratching or cutting integrated circuit chips, PCB circuit boards, and copper pads
5. Quickly removes cured adhesive, black adhesive on chips, and residual filler
6. Ergonomic non-slip handle provides a stable grip for delicate operations.