1. The 2UUL FD40 Find 210 Chip Heating Glue Removal Station is designed for professional mobile motherboard repair, helping technicians soften and remove underfill glue from CPU, NAND Flash, PMIC, and BGA chips.
2. Designed for C210 soldering iron handles, allowing direct installation for precise localized heating during micro soldering and chip repair.
3. The compact heating platform provides targeted heat transfer to IC chips, minimizing heat impact on surrounding motherboard components.
4. With an ultra-lightweight structure of approximately 7g, the FD40 provides excellent control under a microscope for precision repair work.
5. Recommended operating temperature range of approximately 150–200 degrees Celsius, suitable for softening common chip adhesives during repair operations.
2. Designed for C210 soldering iron handles, allowing direct installation for precise localized heating during micro soldering and chip repair.
3. The compact heating platform provides targeted heat transfer to IC chips, minimizing heat impact on surrounding motherboard components.
4. With an ultra-lightweight structure of approximately 7g, the FD40 provides excellent control under a microscope for precision repair work.
5. Recommended operating temperature range of approximately 150–200 degrees Celsius, suitable for softening common chip adhesives during repair operations.