1. Equipped with precise temperature control ranging from 40 to 245 degrees Celsius, ensuring even heat distribution and preventing localized overheating of PCB boards.
2. Specially developed for smartphone motherboard delamination, screen separation, and BGA rework applications, improving repair success rates.
3. Powered by a 240W heating module, allowing fast temperature rise and significantly reducing repair waiting time.
4. Digital temperature regulation ensures consistent thermal output, ideal for microelectronics and chip-level repair tasks.
5. Small footprint (10.5 x 12.2 x 3.2cm) makes it ideal for professional repair benches without occupying excessive workspace.
6. Widely used in smartphone repair, PCB reballing, chip removal, and layered motherboard separation processes.
2. Specially developed for smartphone motherboard delamination, screen separation, and BGA rework applications, improving repair success rates.
3. Powered by a 240W heating module, allowing fast temperature rise and significantly reducing repair waiting time.
4. Digital temperature regulation ensures consistent thermal output, ideal for microelectronics and chip-level repair tasks.
5. Small footprint (10.5 x 12.2 x 3.2cm) makes it ideal for professional repair benches without occupying excessive workspace.
6. Widely used in smartphone repair, PCB reballing, chip removal, and layered motherboard separation processes.