1. High?density firm foam cubes designed specifically for electronic device repair cleaning.
2. Each foam cube measures 7×7×7?mm for easy handling and access to tight spaces.
3. Dense foam material prevents lint and residue buildup, ensuring effective cleaning without contamination.
4. Ideal for removing dirt, dust, solder flux, and adhesive residues on motherboards, camera modules, IC chips, and PCB areas.
5. Foam cubes maintain structural integrity under use and are compatible with common repair solvents.
6. Includes 500 pieces per bag, perfect for repair shops, professional technicians, and DIY repairers.
2. Each foam cube measures 7×7×7?mm for easy handling and access to tight spaces.
3. Dense foam material prevents lint and residue buildup, ensuring effective cleaning without contamination.
4. Ideal for removing dirt, dust, solder flux, and adhesive residues on motherboards, camera modules, IC chips, and PCB areas.
5. Foam cubes maintain structural integrity under use and are compatible with common repair solvents.
6. Includes 500 pieces per bag, perfect for repair shops, professional technicians, and DIY repairers.