1. Motherboard Protection Design: The ball head design effectively prevents damage to the motherboard, ensuring safety during the soldering process.
2. Made from pure copper with gold plating, offering excellent conductivity and anti-oxidation properties.
3. Uniform Tin Coating: The tin-coating process is fast and uniform, ensuring consistent soldering quality.
4. Strong Compatibility: Compatible with various phone models, catering to a diverse range of user needs.
5. High Durability: Quality materials and design extend product lifespan, reducing frequency of replacement.
2. Made from pure copper with gold plating, offering excellent conductivity and anti-oxidation properties.
3. Uniform Tin Coating: The tin-coating process is fast and uniform, ensuring consistent soldering quality.
4. Strong Compatibility: Compatible with various phone models, catering to a diverse range of user needs.
5. High Durability: Quality materials and design extend product lifespan, reducing frequency of replacement.