1. Manufactured from a high-performance, heat-resistant polymer, the BST-3DX chip fixing sticker maintains structural stability under high-temperature soldering and rework conditions without deformation.
2. Equipped with a high-adhesion, flame-retardant adhesive layer, the sticker enables quick and precise chip positioning, ensuring stable fixation during solder paste or solder ball application.
3. Designed to work seamlessly with 3D solder stencils, it provides accurate chip-to-pad alignment, improving solder paste distribution consistency and increasing rework success rates.
4. Compatible with a wide range of SMT and BGA chips, making it a versatile auxiliary tool for various PCB reballing and repair applications.
5. The corrosion-resistant material ensures long service life and stable performance.
6. Quantity: 50 pieces per sheet.
2. Equipped with a high-adhesion, flame-retardant adhesive layer, the sticker enables quick and precise chip positioning, ensuring stable fixation during solder paste or solder ball application.
3. Designed to work seamlessly with 3D solder stencils, it provides accurate chip-to-pad alignment, improving solder paste distribution consistency and increasing rework success rates.
4. Compatible with a wide range of SMT and BGA chips, making it a versatile auxiliary tool for various PCB reballing and repair applications.
5. The corrosion-resistant material ensures long service life and stable performance.
6. Quantity: 50 pieces per sheet.