1. Brand: i2C
2. Model: T18
3. Minimum temperature: 180 Celsius degree
4. Display: LED digital display
5. Maximum temperature: 245 Celsius degree
6. Body size: 13.4 x 11.6 x 1.7cm
7. Scope of use: motherboard separation and bonding
8. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof
9. LCD HD screen display, 2Gears of temp adjustment, for iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions
10. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance
11. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180Celsius degrees in 60 seconds rapidly
12. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient
13. Put the chip on and switch to 245 Celsius degree, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
14. Only one host can support multiple modules, support double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products
2. Model: T18
3. Minimum temperature: 180 Celsius degree
4. Display: LED digital display
5. Maximum temperature: 245 Celsius degree
6. Body size: 13.4 x 11.6 x 1.7cm
7. Scope of use: motherboard separation and bonding
8. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof
9. LCD HD screen display, 2Gears of temp adjustment, for iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions
10. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance
11. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180Celsius degrees in 60 seconds rapidly
12. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient
13. Put the chip on and switch to 245 Celsius degree, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
14. Only one host can support multiple modules, support double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products