1. Supports CPU and chip soldering, suitable for chips with hard drives, with a maximum soldering thickness of 0.9mm.
2. High flexibility, not easily deformed, good elasticity, and can be freely rolled up.
3. Heat-resistant and anti-slip, can withstand temperatures up to 500 degrees Celsius, with adhesive properties for effective anti-slip.
4. High-strength magnetic steel mesh with strong magnetic adsorption design ensures a stronger and more stable soldering.
5. Compatible with chips less than 0.9mm thick, for soldering most current smartphone chips.
2. High flexibility, not easily deformed, good elasticity, and can be freely rolled up.
3. Heat-resistant and anti-slip, can withstand temperatures up to 500 degrees Celsius, with adhesive properties for effective anti-slip.
4. High-strength magnetic steel mesh with strong magnetic adsorption design ensures a stronger and more stable soldering.
5. Compatible with chips less than 0.9mm thick, for soldering most current smartphone chips.