1. Model Ti/Model A: Pry open CPUs, ICs, hard drives, and other precision components.
2. Model i: Suitable for removing adhesive from mobile phone motherboards and ICs/CPUs.
3. Model S: Professional edge adhesive removal tool.
4. Model T: Cuts black adhesive without damaging circuit boards.
5. Model X: Professional edge adhesive removal tool.
6. Not only can it easily cut various materials, but it also maintains its sharpness even when bent.
7. The blade has a vacuum-coated surface, providing excellent corrosion resistance, high-temperature resistance, and wear resistance.
8. Made of 301 stainless steel, it improves efficiency and achieves stable and reliable performance in various repair situations.
2. Model i: Suitable for removing adhesive from mobile phone motherboards and ICs/CPUs.
3. Model S: Professional edge adhesive removal tool.
4. Model T: Cuts black adhesive without damaging circuit boards.
5. Model X: Professional edge adhesive removal tool.
6. Not only can it easily cut various materials, but it also maintains its sharpness even when bent.
7. The blade has a vacuum-coated surface, providing excellent corrosion resistance, high-temperature resistance, and wear resistance.
8. Made of 301 stainless steel, it improves efficiency and achieves stable and reliable performance in various repair situations.