1. Specifically engineered for CPU, NAND, and BGA chip adhesive removal, providing stable clamping and a safe working environment to prevent chip damage.
2. Features a precision positioning system combined with anti-slip design to securely hold chips in place, preventing movement and improving repair success rates.
3. Built with high-temperature and corrosion-resistant materials, making it suitable for hot air rework processes without deformation over time.
4. Designed with an open layout that allows easy glue removal, residue cleaning, and real-time visibility during operation, enhancing workflow efficiency.
5. Supports various chip sizes and motherboard types, making it suitable for smartphones, tablets, and other electronic repair applications.
6. Engineered to enhance heat transfer, enabling faster adhesive softening and reducing operation difficulty during chip repair.
2. Features a precision positioning system combined with anti-slip design to securely hold chips in place, preventing movement and improving repair success rates.
3. Built with high-temperature and corrosion-resistant materials, making it suitable for hot air rework processes without deformation over time.
4. Designed with an open layout that allows easy glue removal, residue cleaning, and real-time visibility during operation, enhancing workflow efficiency.
5. Supports various chip sizes and motherboard types, making it suitable for smartphones, tablets, and other electronic repair applications.
6. Engineered to enhance heat transfer, enabling faster adhesive softening and reducing operation difficulty during chip repair.