1. Removable blade design allows for the removal of black adhesive without scratching IC chips or prying off PCB pads; suitable for removing adhesive from CPUs, hard drives, and various BGA chips.
2. The thin blade design protects pads and easily inserts under the chip to remove residual adhesive; the handle eliminates the risk of prying off pads or scratching circuits.
3. Essential for chip repair and rework: Developed specifically for stubborn black adhesive under CPUs and ICs, effectively reducing the risk of repair failures
4. High-temperature resistant and chip-safe; made of flexible specialty engineering plastic that won’t scratch the IC surface, making it easy to remove black adhesive from motherboard pads
5. The material softens when heated, enhancing its flexibility and allowing it to conform to the surface for easy adhesive removal and cleaning
2. The thin blade design protects pads and easily inserts under the chip to remove residual adhesive; the handle eliminates the risk of prying off pads or scratching circuits.
3. Essential for chip repair and rework: Developed specifically for stubborn black adhesive under CPUs and ICs, effectively reducing the risk of repair failures
4. High-temperature resistant and chip-safe; made of flexible specialty engineering plastic that won’t scratch the IC surface, making it easy to remove black adhesive from motherboard pads
5. The material softens when heated, enhancing its flexibility and allowing it to conform to the surface for easy adhesive removal and cleaning