1. Equipped with a powerful magnetic system that ensures automatic alignment and stable fixation of CPU chips, improving reballing accuracy while minimizing operational errors.
2. Integrates both tin planting (reballing) and adhesive removal in one platform, enabling multiple repair processes with a single tool and significantly enhancing work efficiency.
3. Engineered with precise positioning and limit structures to ensure perfect alignment between stencil and chip, delivering consistent and uniform solder ball formation.
4. Compatible with iPhone 11–17 series CPUs as well as various Android chipsets (Qualcomm, MediaTek, etc.), offering broad application coverage.
5. Built with high-strength, heat-resistant materials that resist deformation, ensuring stability and reliability during prolonged, high-temperature operations.
2. Integrates both tin planting (reballing) and adhesive removal in one platform, enabling multiple repair processes with a single tool and significantly enhancing work efficiency.
3. Engineered with precise positioning and limit structures to ensure perfect alignment between stencil and chip, delivering consistent and uniform solder ball formation.
4. Compatible with iPhone 11–17 series CPUs as well as various Android chipsets (Qualcomm, MediaTek, etc.), offering broad application coverage.
5. Built with high-strength, heat-resistant materials that resist deformation, ensuring stability and reliability during prolonged, high-temperature operations.