1. Dual-station worktable for easy adhesive removal
2. Tempered glass, high temperature resistant and easy to clean
3. Precisely adjustable clamping width, compatible with chips of various sizes
4. Suitable for adhesive removal and pin repair of BGA, CPU, IC and other components
5. Specifically designed for removing black adhesive from mobile phone CPUs, memory ICs, power management ICs and various BGA chips, cleaning solder balls and repairing pins
6. Employs a steplessly adjustable clamping structure, equipped with dual thickness limiting baffles (0.2mm / 0.4mm) and a high-temperature resistant tempered glass work panel, enabling stable chip fixation, safe adhesive removal and efficient chip refurbishment.
2. Tempered glass, high temperature resistant and easy to clean
3. Precisely adjustable clamping width, compatible with chips of various sizes
4. Suitable for adhesive removal and pin repair of BGA, CPU, IC and other components
5. Specifically designed for removing black adhesive from mobile phone CPUs, memory ICs, power management ICs and various BGA chips, cleaning solder balls and repairing pins
6. Employs a steplessly adjustable clamping structure, equipped with dual thickness limiting baffles (0.2mm / 0.4mm) and a high-temperature resistant tempered glass work panel, enabling stable chip fixation, safe adhesive removal and efficient chip refurbishment.