1. Supports multi-point temperature settings, with both standard curve and peak reflux modes.
2. Covers most mobile phone motherboard sizes, ensuring uniform heat conduction and consistent heating across the entire motherboard.
3. Slide-type rotatable clamp with spring-loaded structure, capable of securing motherboards and modules of different sizes.
4. Color display shows real-time temperature, temperature curve, and operating status.
5. Equipped with a Type-C data communication interface and power interface, compact design saves workbench space.
6. Used for motherboard layering, BGA chip desoldering, motherboard separation, and other repairs, adaptable to various international environments.
2. Covers most mobile phone motherboard sizes, ensuring uniform heat conduction and consistent heating across the entire motherboard.
3. Slide-type rotatable clamp with spring-loaded structure, capable of securing motherboards and modules of different sizes.
4. Color display shows real-time temperature, temperature curve, and operating status.
5. Equipped with a Type-C data communication interface and power interface, compact design saves workbench space.
6. Used for motherboard layering, BGA chip desoldering, motherboard separation, and other repairs, adaptable to various international environments.