EDA010208002.jpg@d193258ec03369d0bc3ee5f834a7691b
EDA0102080_B1.jpg@9c328f4148b11eb4c9f5977ac726ffc1
EDA0102080_B2.jpg@43e15dfc3dc66aabd66a4957a9eeda44
EDA0102080_B3.jpg@ac34e2ae992224f732c502909f73bb0a
EDA0102080_B4.jpg@306b7622570a6334d18b22aaf7281e48
EDA0102080_B5.jpg@1dfc744ceabf1259089012d839674ac4
EDA0102080_B6.jpg@ac99b8d68477e3e37810e3e991ea076e
EDA0102080_B7.jpg@62b3ca4d1cb9b4554cedb4a5fc55a2b7
EDA0102080_B8.jpg@bb4704b3792eaab76cbed0d8b29eb673
  • Load image into Gallery viewer, EDA010208002.jpg@d193258ec03369d0bc3ee5f834a7691b
  • Load image into Gallery viewer, EDA0102080_B1.jpg@9c328f4148b11eb4c9f5977ac726ffc1
  • Load image into Gallery viewer, EDA0102080_B2.jpg@43e15dfc3dc66aabd66a4957a9eeda44
  • Load image into Gallery viewer, EDA0102080_B3.jpg@ac34e2ae992224f732c502909f73bb0a
  • Load image into Gallery viewer, EDA0102080_B4.jpg@306b7622570a6334d18b22aaf7281e48
  • Load image into Gallery viewer, EDA0102080_B5.jpg@1dfc744ceabf1259089012d839674ac4
  • Load image into Gallery viewer, EDA0102080_B6.jpg@ac99b8d68477e3e37810e3e991ea076e
  • Load image into Gallery viewer, EDA0102080_B7.jpg@62b3ca4d1cb9b4554cedb4a5fc55a2b7
  • Load image into Gallery viewer, EDA0102080_B8.jpg@bb4704b3792eaab76cbed0d8b29eb673

YCS Divine Dragon Flame CH898 Motherboard Layer Separation Heating Stage, Plug:US Plug

Regular price
R 1,566.18
Sale price
R 1,566.18
Regular price
Sold out
Unit price
per 
Shipping calculated at checkout.

1. The YCS Divine Dragon Flame CH898 Heating Stage is engineered for precision repair of mobile phone motherboards, supporting layer separation, lamination, and dot matrix repair. It delivers consistent, even heating to protect delicate components during complex repairs.
2. Adjustable temperature: 40 to 260 degrees Celsius (via digital controls). One-click switching for 3 common presets: 100 / 220 / 240 degrees Celsius (ideal for micro-soldering/Android/Apple and multi-excavation repair modes).
3. The 96x53mm oversized platform fits most mobile phone motherboards (and small PCBs). Its aluminum alloy construction ensures rapid, uniform heat distribution—boosting repair efficiency by 30%+ compared to standard stages.
4. Stable, scratch-free clamps secure your motherboard in place. The arms slide along dedicated slots (front/back of the platform) and rotate 360 degrees, enabling easy access to all edges for precise, hassle-free repairs.
5. Aluminum alloy heating technology eliminates hot spots, ensuring consistent temperature across the entire platform. This reduces repair time and prevents thermal damage to sensitive components.
6. Compact & Lightweight: Fits any workspace (desk/repair bench) without clutter.
7. Clear Dual Display: Real-time temperature (degrees Celsius) and time tracking for precise control.
8. Anti-Slip Feet: Rubber pads on the base prevent slipping during operation.